THERMOCOMPRESSION BONDING DEVICE FOR CHIP

PROBLEM TO BE SOLVED: To provide a device for thermally compressing and bonding all electrodes of a chip to electrodes of a board with a uniform force by pushing the chip electrodes against the board electrodes. SOLUTION: The thermocompression bonding head 40 includes a moving up/down block 41 coupled to a rod 35 of a cylinder, a thermocompression bonding tool 43 held in a holding member 49 under the moving up/down block 41, and a heat block 47 provided behind the block 41. Since the thermocompression bonding tool 43 is heated from its rear side by a heater 48 incorporated with in the heat block 47, a vertical temperature distribution becomes uniform ion the thermocompression bonding tool 43. When the head 40 is moved down to be pushed against leads 4 of a chip 3, all the leads 4 are thermally compressed and bonded to electrodes 2 of a substrate 1 through an anisotropic conductive tape 5. When the holding member 49 is removed, the thermocompression bonding tool 43 can be easily exchanged with a new one.