MANUFACTURE OF CHIP INDUCTOR

PROBLEM TO BE SOLVED: To obtain a highly reliable chip inductor which can be handled in the state of a substrate from which multiple chip inductors can be manufactured through almost all its manufacturing process and can be manufactured with high productivity without requiring any complicated facility and from which connecting sections are eliminated by integrating conductors of a winding section with those of electrode section. SOLUTION: A coil composed of a conductor film 14 is formed by forming a spiral removed section in the conductor film 14 formed on the surface of a substrate 10 so that the film 14 can be left in bridge sections 16 in such a way that, after the entire surface of the substrate 10 is coated with the conductor film 14 and a plurality of removed sections are formed by irradiating adjacent two surfaces of each bridge section 16 with a laser beam from an oblique direction while the surface of the substrate 10 is scanned with the laser beam a plurality of times, the substrate 10 is inverted and the remaining adjacent two surfaces of each bridge section 16 are irradiated with the laser beam in the same manner.