EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which is excellent in adhesiveness and reliability and can accomplish the size reduction and capability improvement of a resin-sealed semiconductor device and to provide a semiconductor device sealed therewith. SOLUTION: A resin-sealed semicondu...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA MASAYUKI, TSURUMI YUMIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which is excellent in adhesiveness and reliability and can accomplish the size reduction and capability improvement of a resin-sealed semiconductor device and to provide a semiconductor device sealed therewith. SOLUTION: A resin-sealed semiconductor device is provided which comprises a semiconductor element 1, a substrate board 2 on which the element is mounted, and an epoxy resin compsn. 3 for sealing the element and in which the resin compsn. is molded on one side only of the substrate board. The resin compsn. contains an epoxy resin, a curative, and an inorg. filler. The curative essentially contains a phenol compd. which has at least two arom. groups having directly bonded hydroxyl groups and has an alicyclic group present between the arom. groups.