METHOD AND APPARATUS FOR FORMING SOLDER ON BOARD

PROBLEM TO BE SOLVED: To array solders at desired positions on a board by arraying decals on the board, and transferring solder regions on the decals to the board. SOLUTION: Solder dacals 110 are arranyed against a ball grid array package 112, and solder paste regions 113 are brought into contact wi...

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Bibliographische Detailangaben
Hauptverfasser:	GREGORY B HOTCHKISS, GARY D STEPHENS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To array solders at desired positions on a board by arraying decals on the board, and transferring solder regions on the decals to the board. SOLUTION: Solder dacals 110 are arranyed against a ball grid array package 112, and solder paste regions 113 are brought into contact with parts of the ball grid array package 112. Following this, the solder paste regions 113 are transferred to the ball grid array package 112. The solder paste regions 113 are transferred by heat and form transferred solder members 114. The transferred solder members 114 formed on a ball grid array package 116 fittable instantly provide a large number of electric contacts, and facilitate connection from one electronic device to others. Accordingly, it is possible to fit them to the contact pads of various electronic parts like a printed circuit board.