DRESSER AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To provide a dresser and its manufacturing method which can simply and accurately measure the protrusive quantity of the ultraabrasive grain on the ultraabrasive grain layer surface, precisely control the protrusive quantity of the ultraabrasive grain and which is specially suitable for dressing chemical/ mechanical polishing pad for a semiconductor wafer. SOLUTION: This dresser includes an area 2 on the ultraabrasive grain layer surface where the ultraabrasive grain composed only of a plated layer does not exist and a plated surface of an area 3 where the ultraabrasive grain exists and the plated surface of the area 2 where the ultraabrasive grain does not exists are on the identical plane. This dressing method is to provide an area on the ultraabrasive grain fixing surface of a mother die to which the ultraabrasive grain does not stick by masking a part of it, remove the masking after temporary fixing the ultraabrasive grain 1 layer by embedding and fixing the ultraabrasive grain 1 by plating, connect a base metal to the plating growth side of the ultraabrasive grain layer, and carry out stone exposure process after removing the mother die.