CLEANING MEMBER AND CLEANING METHOD

PROBLEM TO BE SOLVED: To realize easy cleaning by forming an adhesive film having specific viscosity on a semiconductor a semiconductor wafer thereby removing dust efficiently without causing any damage at the forward end part of a probe pin at all. SOLUTION: The cleaning member has such surface shape as touching the line or surface defined by the forward end part of a semiconductor measuring probe simultaneously and generally has a planar shape. An adhesive of various forms is employed as an adhesive substance and an acryl based adhesive is preferably employed in order to avoid so-called residual paste. Dust is left easily when the viscosity (JISZ0237) of an adhesive substance is lower than 100g/25mm, and a paste is left easily on the surface of the semiconductor measuring probe when it exceeds 250g/25mm and thereby the viscosity is preferably set in the range 120g/25mm-200g/25mm. Thickness of the adhesive substance is preferably set in such range as the forward part of a pin is inserted sufficiently without leaving any paste and it is generally set in the range of 10-50μm.