MARKING APPARATUS AND MARKING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a marking technique which reduces variation of marking quality of semiconductor packages. SOLUTION: At a marking position, a pressing member (hereinafter referred to as a mark mask 1) for correcting deformation of a lead frame by pressing resin sealed portions 3 of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAEDA TAKESHI, OSAKA SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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