MARKING APPARATUS AND MARKING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a marking technique which reduces variation of marking quality of semiconductor packages. SOLUTION: At a marking position, a pressing member (hereinafter referred to as a mark mask 1) for correcting deformation of a lead frame by pressing resin sealed portions 3 of the lead frame 2 or a frame portion around the resin sealed portions 3 is provided. In the mark mask 1, passing-through protons 4 for exposing the surfaces of the resin sealed portions 3 in accordance with an array in the direction of column of the resin sealed portions 3 formed in the lead frame 2 are provided. The passing-through portions 4 are formed in such a manner that a mark stamp 14 corresponding to the array in the direction of column of the resin sealed portions 3 is allowed to pass through from above the mark mask 1 to the surfaces of the resin sealed portions 3.