PHENOLIC RESIN MOLDING MATERIAL FOR INJECTION MOLDING

PHENOLIC RESIN MOLDING MATERIAL FOR INJECTION MOLDING

PROBLEM TO BE SOLVED: To provide a phenolic resin molding material for injection molding which can markedly improve the mechanical strength of a molding to a significant level without sacrificing the utility and has excellent releasability from a heated mold at the time of molding. SOLUTION: This ph...

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Hauptverfasser: NAGATANI YASUHISA, KATAYAMA HISASHI, SATO YUZURU
Format: Patent
Sprache:eng
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CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator NAGATANI YASUHISA
KATAYAMA HISASHI
SATO YUZURU
description PROBLEM TO BE SOLVED: To provide a phenolic resin molding material for injection molding which can markedly improve the mechanical strength of a molding to a significant level without sacrificing the utility and has excellent releasability from a heated mold at the time of molding. SOLUTION: This phenolic resin molding material comprises: a molding material composed mainly of a phenolic resin, a reinforcement, and a filler; and, incorporated therein, 1 to 5wt.% at least one plasticizer selected from among p-toluenesulfonamide, dicyclohexyl phthalate, and triphenyl phosphate and 1 to 5wt.% thermoplastic resin having a melt viscosity at 150 deg.C of not more than 100 Pa/s and a compatibility with a phenolic resin of not more than 20% at 150 deg.C.
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SOLUTION: This phenolic resin molding material comprises: a molding material composed mainly of a phenolic resin, a reinforcement, and a filler; and, incorporated therein, 1 to 5wt.% at least one plasticizer selected from among p-toluenesulfonamide, dicyclohexyl phthalate, and triphenyl phosphate and 1 to 5wt.% thermoplastic resin having a melt viscosity at 150 deg.C of not more than 100 Pa/s and a compatibility with a phenolic resin of not more than 20% at 150 deg.C.</description><edition>6</edition><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19980623&amp;DB=EPODOC&amp;CC=JP&amp;NR=H10168277A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19980623&amp;DB=EPODOC&amp;CC=JP&amp;NR=H10168277A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGATANI YASUHISA</creatorcontrib><creatorcontrib>KATAYAMA HISASHI</creatorcontrib><creatorcontrib>SATO YUZURU</creatorcontrib><title>PHENOLIC RESIN MOLDING MATERIAL FOR INJECTION MOLDING</title><description>PROBLEM TO BE SOLVED: To provide a phenolic resin molding material for injection molding which can markedly improve the mechanical strength of a molding to a significant level without sacrificing the utility and has excellent releasability from a heated mold at the time of molding. 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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title PHENOLIC RESIN MOLDING MATERIAL FOR INJECTION MOLDING
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