PHENOLIC RESIN MOLDING MATERIAL FOR INJECTION MOLDING

PROBLEM TO BE SOLVED: To provide a phenolic resin molding material for injection molding which can markedly improve the mechanical strength of a molding to a significant level without sacrificing the utility and has excellent releasability from a heated mold at the time of molding. SOLUTION: This ph...

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Bibliographische Detailangaben
Hauptverfasser: NAGATANI YASUHISA, KATAYAMA HISASHI, SATO YUZURU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a phenolic resin molding material for injection molding which can markedly improve the mechanical strength of a molding to a significant level without sacrificing the utility and has excellent releasability from a heated mold at the time of molding. SOLUTION: This phenolic resin molding material comprises: a molding material composed mainly of a phenolic resin, a reinforcement, and a filler; and, incorporated therein, 1 to 5wt.% at least one plasticizer selected from among p-toluenesulfonamide, dicyclohexyl phthalate, and triphenyl phosphate and 1 to 5wt.% thermoplastic resin having a melt viscosity at 150 deg.C of not more than 100 Pa/s and a compatibility with a phenolic resin of not more than 20% at 150 deg.C.