RESIN COMPOSITION FOR SEALING ELECTRONIC PART

PROBLEM TO BE SOLVED: To obtain the subject composition that has good fluidity with low viscosity and high mechanical strength by containing a synthetic resin and a specific inorganic fiber. SOLUTION: This resin composition contains (A) a synthetic resin and (B) at least one selected from single cry...

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Bibliographische Detailangaben
Hauptverfasser:	YASUKI MINORU, TANAKA TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain the subject composition that has good fluidity with low viscosity and high mechanical strength by containing a synthetic resin and a specific inorganic fiber. SOLUTION: This resin composition contains (A) a synthetic resin and (B) at least one selected from single crystalline inorganic fiber and polycrystalline inorganic fiber with an average fiber length of