IC CARD

IC CARD

PROBLEM TO BE SOLVED: To provide an IC card wherein an IC module does not separat from a substrate even at comparatively higher temperature, the card substrate is not deformed by heat when the IC module is bonded, bonding operation is simple, and an apparatus for bond operation can be simplified. SO...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KONDO MASUMI, KISHIMOTO HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SPECIAL PRINTED MATTER
TRANSPORTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an IC card wherein an IC module does not separat from a substrate even at comparatively higher temperature, the card substrate is not deformed by heat when the IC module is bonded, bonding operation is simple, and an apparatus for bond operation can be simplified. SOLUTION: A recessed part 2 is provided on one side of a card substrate 1, and an IC module 3 is fixed by bonding via a reactive hot melt adhesive being an adhesion layer 15 in the recessed part 2. As the reactive hot melt adhesive, a moisture curing type urethane hot melt adhesive is concretely used. A stopper 13 for controlling a height position of the IC module 3 in a thickness direction of the card substrate 1 is protruded on a bottom wall 12 in the recessed part 2 bonded to the IC module 3 via the adhesion layer 15. The stopper 13 has a function wherein a thickness of the adhesion layer 15 formed between the card substrate 1 and the IC module 3 is controlled.