SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To raise reliability and to improve manufacturing yield. SOLUTION: In a device 11, when a semiconductor ship 12 is flip-chip- mounted, with the face down, on the top surface of a mounting board 13, a real electrode pad 14 of the semiconductor chip 12 is provided with a bump 18...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OIDA MITSURU, AOKI HIDEO, NAKAZAWA TAKAHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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