SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To raise reliability and to improve manufacturing yield. SOLUTION: In a device 11, when a semiconductor ship 12 is flip-chip- mounted, with the face down, on the top surface of a mounting board 13, a real electrode pad 14 of the semiconductor chip 12 is provided with a bump 18...

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Bibliographische Detailangaben
Hauptverfasser:	OIDA MITSURU, AOKI HIDEO, NAKAZAWA TAKAHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To raise reliability and to improve manufacturing yield. SOLUTION: In a device 11, when a semiconductor ship 12 is flip-chip- mounted, with the face down, on the top surface of a mounting board 13, a real electrode pad 14 of the semiconductor chip 12 is provided with a bump 18 formed of solder in advance, and dummy electrode terminals 17 on four corner parts of the mounting board 13 are provided with a bump 19 formed of gold. Here, the bump 18 of solder is aligned with a rear electrode terminal 16 of the mounting board 13 and then heated, and the bump 19 of gold aligned with a dummy electrode pad 15 on corner parts of the semiconductor chip 12, and they are pressed under a specified load, thereby the bump of gold acts as a spacer to secure a specified interval between the semiconductor ship 12 and the mounting board 13, and the bump 18 of solder is melted and cooled for sure connection.