PRINTED-WIRING BOARD

PROBLEM TO BE SOLVED: To prevent separation of a solder resist layer from conductor circuits and separation of a solder body from a pad at the time of a heat cycle by a method wherein the surface of the pad is used as conductive roughened layers, a metal layer is provided on the part of the pad exposed through an open part provided in the solder resist layer and the solder body is held on the pad via this metal layer. SOLUTION: Conductive roughened layers 8 are respectively formed in parts, which correspond to the surfaces of conductor circuits 3, of the uppermost surface layer, on which a solder resist layer 12 is formed. These layers 8 act as an anchor to make the circuits 3 closely adhere firmly to the layer 12. A solder body SL is formed on a metal layer 14 having a non-oxidizing metal layer on at least its surface. This layer 14 is firmly adhered closely to a pad via the conductive roughened layers 8. Moreover, it is necessary that the pad for holding the solder body SL is exposed through an open part provided in the layer 12. At that time, the surface of one part of the pad may be exposed through the open part and the entire surface of the pad may be exposed.