ELECTROLESS NICKEL PLATING SOLUTION

PROBLEM TO BE SOLVED: To obtain an electroless nickel plating soln. from which sulfates are not formed and accumulated in plating by mixing the the hydrous nickel hypophosphite as the main chemical for supplying Ni ion and H2 PO2 ion and the hypophosphorous acid, etc., as a molar ratio regulator to...

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Bibliographische Detailangaben
Hauptverfasser: HORIKAWA TAKESHI, MITA MUNEO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an electroless nickel plating soln. from which sulfates are not formed and accumulated in plating by mixing the the hydrous nickel hypophosphite as the main chemical for supplying Ni ion and H2 PO2 ion and the hypophosphorous acid, etc., as a molar ratio regulator to prepare the plating soln. SOLUTION: A plating soln. contg. hydrous nickel hypophosphite (nickel hypophosphite hexahydrate is preferable) as the main chemical for supplying metallic ion Ni and hypophosphite ion H2 PO2 as a reducing agent and hypophosphorous acid and/or sodium hypophosphite as the molar ration regulator is prepared. At this time, the plating soln. contains 0.017-0.34mol/l Ni and 0.017-10mol/l H2 PO2 in the stationary state, the molar ratio of H2 PO2 to Ni is controlled to 2.5-4, and the pH is regulated to 4.5-5.5 in an acid bath and to 9-10 in the alkali bath. An electroless nickel plating soln. having a long service life, with the exhausted plating soln. easily discarded and capable of being regenerated and utilized is obtained in this way.