HOLDING SUBSTRATE FOR THIN TYPE COIL

PURPOSE: To provide a holding substrate for a thin type coil which can obtain a sufficient holding strength and coil characteristic while being formed thin. CONSTITUTION: This holding substrate is formed by having a plurality of coil- shaped coil insertion parts 10 in one surface of a metal pattern plate worked in a wire connection pattern shape and integrally molding a coil holder part 3 formed of resin. An insulation layer 18 is formed by covering the metal pattern plate exposed from the coil holder part 3, also through this insulation layer 18, a generating coil pattern 19 is formed on the insulation layer 18. The metal pattern plate may be a lead frame 2 formed by a copper system alloy or plating thereof, and a thickness may be set to 0.05 to 0.15mm. A thickness of a mold bottom part 3a may be set to 0.05 to 0.15mm.