ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide an electroplating device with which plating thickness distributions are made uniform by inserting many current shielding plates long in a longitudinal direction perpendicular to the long-sized anode plates and cathode plates disposed in a plating bath between these plates. SOLUTION: Deformed metallic bars 3 having ruggedness at their sections as the long-sized anode plates 2 and the long-sized cathode plates are arranged in parallel within the plating vessel of the electroplating device. The current shielding plates 8 which are perpendicular to the electrode plates and are long in the longitudinal direction are inserted between these plates. The thicknesses or the spacings between the slits of the current shielding plates 8 are made freely variable partly according to the ruggedness of the cathode plates and the spacings δ thereof are preferably set at 20 to 40mm. Further, the plating liquids are preferably ejected out of fluid nozzles 7 arranged below the vessel and are made to flow. As a result, the current distribution between the electrodes are made uniform and the current concentration to the edge parts, etc., varying in the plate thickness parts is relieved, by which the fluctuations in the plating thicknesses are suppressed even with the deformed metallic bars having the ruggedness at their sections.