SOLDER ALLOY
PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, an...
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| creator | KAN ZAIKO KIN JINTETSU AN KYOKI |
| description | PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH10137971A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH10137971A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH10137971A3</originalsourceid><addsrcrecordid>eNrjZOAJ9vdxcQ1ScPTx8Y_kYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEehgaGxuaW5oaOxsSoAQCVNhyZ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDER ALLOY</title><source>esp@cenet</source><creator>KAN ZAIKO ; KIN JINTETSU ; AN KYOKI</creator><creatorcontrib>KAN ZAIKO ; KIN JINTETSU ; AN KYOKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced.</description><edition>6</edition><language>eng</language><subject>ALLOYS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980526&DB=EPODOC&CC=JP&NR=H10137971A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980526&DB=EPODOC&CC=JP&NR=H10137971A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAN ZAIKO</creatorcontrib><creatorcontrib>KIN JINTETSU</creatorcontrib><creatorcontrib>AN KYOKI</creatorcontrib><title>SOLDER ALLOY</title><description>PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced.</description><subject>ALLOYS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAJ9vdxcQ1ScPTx8Y_kYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEehgaGxuaW5oaOxsSoAQCVNhyZ</recordid><startdate>19980526</startdate><enddate>19980526</enddate><creator>KAN ZAIKO</creator><creator>KIN JINTETSU</creator><creator>AN KYOKI</creator><scope>EVB</scope></search><sort><creationdate>19980526</creationdate><title>SOLDER ALLOY</title><author>KAN ZAIKO ; KIN JINTETSU ; AN KYOKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH10137971A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>ALLOYS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KAN ZAIKO</creatorcontrib><creatorcontrib>KIN JINTETSU</creatorcontrib><creatorcontrib>AN KYOKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAN ZAIKO</au><au>KIN JINTETSU</au><au>AN KYOKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER ALLOY</title><date>1998-05-26</date><risdate>1998</risdate><abstract>PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH10137971A |
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| subjects | ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | SOLDER ALLOY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T08%3A37%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAN%20ZAIKO&rft.date=1998-05-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH10137971A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |