SOLDER ALLOY

PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, an...

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Bibliographische Detailangaben
Hauptverfasser:	KAN ZAIKO, KIN JINTETSU, AN KYOKI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the fatigue strength of a soldered part by containing Sn, Sb, Ag, P, Pb, Cu, Bi, Ni, Ge, Te, Ga and In of the prescribed quantity in the solder. SOLUTION: The solder has the composition consisting of, by weight, 50-80% Sn, 0.05-10% Sb, 0.0001-5% Ag, 0.0001-0.5% P, and at least one kind of the element S to be selected among 0.01-1% Cu, 0.01-5% Bi, 0.01-5% Ni, 0.001-0.5% Ge, 0.001-1% Te, 0.001-1% Ga, and 0.001-1% In, and the balance substantially Pb. Sb increases the strength. If Sb is excessive, the flowability of the solder is reduced. Ag increases the strength and improves the softness. P increases the strength, suppresses the oxidizing reaction, and improves the stress resistance to withstand the thermal stress and vibration of a soldered part. If P is excessive, the flowability of the solder is reduced.