STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE
PROBLEM TO BE SOLVED: To improve mounting density and enable miniaturization, by aligning a solder electrode with a connecting pattern, mounting one single body mounting board on the other single body mounting board, wherein an electronic component is mounted on the upper surface of a circuit board...
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| creator | OGATA SHIGEYUKI |
| description | PROBLEM TO BE SOLVED: To improve mounting density and enable miniaturization, by aligning a solder electrode with a connecting pattern, mounting one single body mounting board on the other single body mounting board, wherein an electronic component is mounted on the upper surface of a circuit board and solder electrodes are bonded to the lower surface, and making a multilayered mounting board. SOLUTION: An electronic component 5 like a semiconductor is mounted on the upper surface of a first circuit board 3 on which surface a connecting pattern 4 is formed. The upper part of the electronic component 5 is sealed with resin material, and a protective film 6 is formed. Solder electrodes 7 are formed on the lower surface, and a first single body mounting board 1 is formed. An electronic component 9 is mounted on the upper surface of a second circuit board 8 in the same way, and a protective film 10 is formed on the electronic component 9. Solder electrodes 11 are arranged on the lower surface, and a second single body mounting board 2 is formed. The solder electrodes 11 of the second mounting board 2 are aligned with the connecting pattern 4, the second mounting board 2 is stacked on the first mounting board 1, the first mounting board 1 and the second mounting board 2 are multilayered by fusing the solder electrodes 11. Thereby a multilayered structure is obtained. |
| format | Patent |
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SOLUTION: An electronic component 5 like a semiconductor is mounted on the upper surface of a first circuit board 3 on which surface a connecting pattern 4 is formed. The upper part of the electronic component 5 is sealed with resin material, and a protective film 6 is formed. Solder electrodes 7 are formed on the lower surface, and a first single body mounting board 1 is formed. An electronic component 9 is mounted on the upper surface of a second circuit board 8 in the same way, and a protective film 10 is formed on the electronic component 9. Solder electrodes 11 are arranged on the lower surface, and a second single body mounting board 2 is formed. The solder electrodes 11 of the second mounting board 2 are aligned with the connecting pattern 4, the second mounting board 2 is stacked on the first mounting board 1, the first mounting board 1 and the second mounting board 2 are multilayered by fusing the solder electrodes 11. Thereby a multilayered structure is obtained.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980522&DB=EPODOC&CC=JP&NR=H10135267A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980522&DB=EPODOC&CC=JP&NR=H10135267A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGATA SHIGEYUKI</creatorcontrib><title>STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE</title><description>PROBLEM TO BE SOLVED: To improve mounting density and enable miniaturization, by aligning a solder electrode with a connecting pattern, mounting one single body mounting board on the other single body mounting board, wherein an electronic component is mounted on the upper surface of a circuit board and solder electrodes are bonded to the lower surface, and making a multilayered mounting board. SOLUTION: An electronic component 5 like a semiconductor is mounted on the upper surface of a first circuit board 3 on which surface a connecting pattern 4 is formed. The upper part of the electronic component 5 is sealed with resin material, and a protective film 6 is formed. Solder electrodes 7 are formed on the lower surface, and a first single body mounting board 1 is formed. An electronic component 9 is mounted on the upper surface of a second circuit board 8 in the same way, and a protective film 10 is formed on the electronic component 9. Solder electrodes 11 are arranged on the lower surface, and a second single body mounting board 2 is formed. The solder electrodes 11 of the second mounting board 2 are aligned with the connecting pattern 4, the second mounting board 2 is stacked on the first mounting board 1, the first mounting board 1 and the second mounting board 2 are multilayered by fusing the solder electrodes 11. Thereby a multilayered structure is obtained.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPDgkKdQ4JDXJV8HdT8PUP9Qvx9HNXcPJ3DHJRcPRzUfAMCVbwdfQLdXMEq-JhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GBobGpkZm5o7GxKgBABm6Jkc</recordid><startdate>19980522</startdate><enddate>19980522</enddate><creator>OGATA SHIGEYUKI</creator><scope>EVB</scope></search><sort><creationdate>19980522</creationdate><title>STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE</title><author>OGATA SHIGEYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH10135267A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OGATA SHIGEYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGATA SHIGEYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE</title><date>1998-05-22</date><risdate>1998</risdate><abstract>PROBLEM TO BE SOLVED: To improve mounting density and enable miniaturization, by aligning a solder electrode with a connecting pattern, mounting one single body mounting board on the other single body mounting board, wherein an electronic component is mounted on the upper surface of a circuit board and solder electrodes are bonded to the lower surface, and making a multilayered mounting board. SOLUTION: An electronic component 5 like a semiconductor is mounted on the upper surface of a first circuit board 3 on which surface a connecting pattern 4 is formed. The upper part of the electronic component 5 is sealed with resin material, and a protective film 6 is formed. Solder electrodes 7 are formed on the lower surface, and a first single body mounting board 1 is formed. An electronic component 9 is mounted on the upper surface of a second circuit board 8 in the same way, and a protective film 10 is formed on the electronic component 9. Solder electrodes 11 are arranged on the lower surface, and a second single body mounting board 2 is formed. The solder electrodes 11 of the second mounting board 2 are aligned with the connecting pattern 4, the second mounting board 2 is stacked on the first mounting board 1, the first mounting board 1 and the second mounting board 2 are multilayered by fusing the solder electrodes 11. Thereby a multilayered structure is obtained.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE |
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