STRUCTURE OF MOUNTING BOARD AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To improve mounting density and enable miniaturization, by aligning a solder electrode with a connecting pattern, mounting one single body mounting board on the other single body mounting board, wherein an electronic component is mounted on the upper surface of a circuit board and solder electrodes are bonded to the lower surface, and making a multilayered mounting board. SOLUTION: An electronic component 5 like a semiconductor is mounted on the upper surface of a first circuit board 3 on which surface a connecting pattern 4 is formed. The upper part of the electronic component 5 is sealed with resin material, and a protective film 6 is formed. Solder electrodes 7 are formed on the lower surface, and a first single body mounting board 1 is formed. An electronic component 9 is mounted on the upper surface of a second circuit board 8 in the same way, and a protective film 10 is formed on the electronic component 9. Solder electrodes 11 are arranged on the lower surface, and a second single body mounting board 2 is formed. The solder electrodes 11 of the second mounting board 2 are aligned with the connecting pattern 4, the second mounting board 2 is stacked on the first mounting board 1, the first mounting board 1 and the second mounting board 2 are multilayered by fusing the solder electrodes 11. Thereby a multilayered structure is obtained.