BUMP-FORMING METHOD

BUMP-FORMING METHOD

PROBLEM TO BE SOLVED: To provide a bump-forming method, capable of stably cutting wires. SOLUTION: A wire 12, passing through a hole 11a of a capillary 11, is heated at the top end to form a ball 12a which is then pressed and bonded to a terminal electrode 14. Thereafter, only the capillary 11 is mo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MURAIDA MICHIO, NAKADA YOSHISHIGE, SUZUKI KAZUTAKA, SUZUKI YOSHIKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bump-forming method, capable of stably cutting wires. SOLUTION: A wire 12, passing through a hole 11a of a capillary 11, is heated at the top end to form a ball 12a which is then pressed and bonded to a terminal electrode 14. Thereafter, only the capillary 11 is moved up and a current/voltage is applied to a discharge electrode 15 to cause an electric discharge at the top end of a hole 11a. This causes the wire 12 to be cracked and the wire 12 to be cut off at the hole end of the capillary 11.