BUMP AND FORMING METHOD THEREOF

BUMP AND FORMING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a bump well connectable by a flip chip bonding method. SOLUTION: The bump 1 has relations: h/w=1 or h/w 1, where w is max. overall size of the bump 1 and h is height thereof. If a pressing force is exerted on each bump 1, when being connected by a flip chip bonding m...

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Bibliographische Detailangaben
Hauptverfasser: MURAIDA MICHIO, NAKADA YOSHISHIGE, SUZUKI KAZUTAKA, SUZUKI YOSHIKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bump well connectable by a flip chip bonding method. SOLUTION: The bump 1 has relations: h/w=1 or h/w 1, where w is max. overall size of the bump 1 and h is height thereof. If a pressing force is exerted on each bump 1, when being connected by a flip chip bonding method, resultant stress from the pressing force is absorbed because of the height h thereof which is sufficient to prevent the entire shape of the bump 1 from deforming, thus ensuring expected height of the bump, corresponding to the space between the terminal electrode and conductor.