METHOD OF FORMING BUMPS

PROBLEM TO BE SOLVED: To stably form bumps of a specified shape, by depositing a conductor paste on bump forming regions and radiating a laser beam on the paste. SOLUTION: For forming bumps a conductor paste P is deposited in a specified shape on terminal electrodes 2; the shape depending on a paste...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURAIDA MICHIO, NAKADA YOSHISHIGE, SUZUKI KAZUTAKA, SUZUKI YOSHIKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!