METHOD OF FORMING BUMPS

PROBLEM TO BE SOLVED: To stably form bumps of a specified shape, by depositing a conductor paste on bump forming regions and radiating a laser beam on the paste. SOLUTION: For forming bumps a conductor paste P is deposited in a specified shape on terminal electrodes 2; the shape depending on a paste...

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Bibliographische Detailangaben
Hauptverfasser: MURAIDA MICHIO, NAKADA YOSHISHIGE, SUZUKI KAZUTAKA, SUZUKI YOSHIKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To stably form bumps of a specified shape, by depositing a conductor paste on bump forming regions and radiating a laser beam on the paste. SOLUTION: For forming bumps a conductor paste P is deposited in a specified shape on terminal electrodes 2; the shape depending on a paste depositing means is pref. circular columnar, drum-like, truncated circular conical, or semi- spherical in approximately fixed size. A laser beam LB is radiated through an optical system on the paste P deposited on the electrodes 2 to apply a thermal energy on the entire deposited paste P enough to evaporate solvents in the paste and thermally decompose a binder, thus baking the paste P and hence forming bumps 3 of a shape corresponding to the deposited paste P on the electrodes 2. Thus, bumps are formed in a simple procedure and stably in the shape corresponding to the paste deposition shape.