THERMOSTAT

PROBLEM TO BE SOLVED: To simplify a structure, reduce the number of part items and assembling manhours, reduce the cost, and miniaturize the structure by forming a connecting rod integrally with a case and respondably to the movement of a bimetal. SOLUTION: A bimetal 8 is inverted when it is heated...

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Bibliographische Detailangaben
1. Verfasser: HIKITA HIROSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To simplify a structure, reduce the number of part items and assembling manhours, reduce the cost, and miniaturize the structure by forming a connecting rod integrally with a case and respondably to the movement of a bimetal. SOLUTION: A bimetal 8 is inverted when it is heated to the operating temperature by the heat from a thermo-sensitive face cover 4A, a moving contact point plate 7 is lowered via a connecting rod 2, and an electric circuit connected between moving and fixed contact points 6, 5 is turned off. A gill 2A connected from the inner face of a case 1 to the connecting rod 2 does not hinder the downward movement of the connecting rod 2. When the temperature is decreased, the bimetal 8 is oppositely inverted, the connecting rod 2 is returned to the original position by the restoring force of the gill 2A and the spring force of the contact point plate 7, and the electric circuit is turned on. A groove 3A is preferably formed on a terminal board 3 fitted with the contact point 5 to make the terminal board 3 easily bendable, and the adjustment of the contact point 5 is facilitated. The irregularities formed on both face sides of the cover 4A are pressed into the inner edge of the case 1, and this device is miniaturized.