SHIELD STRUCTURE FOR ELECTRONIC SUBSTRATE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To surely connect a substrate and shield materials with the minimum number of bolts and obtain a good shield performance by fixing the shield materials on the electronic substrate in an elastically deformed state. SOLUTION: This structure is constituted of an electronic substra...

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1. Verfasser: KOMATSU NOBORU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To surely connect a substrate and shield materials with the minimum number of bolts and obtain a good shield performance by fixing the shield materials on the electronic substrate in an elastically deformed state. SOLUTION: This structure is constituted of an electronic substrate 1 and a shield material 10 which is made of electromagnetic shield substance and which is laid upon the electronic substrate 1 integrally with the substrate 1 and then is connected to the substrate 1. The shield material 10 is fixed on the electronic substrate 1 in an elastically deformed state. Due to this structure, an airtightness between the shield material 10 and the electronic substrate 1 can be maintained by means of stress generated by elastic deformation of the shield materials 10. In the case that the shield materials 10 which are projecting in the opposite directions are installed on both sides of the substrate, elastic forces of the shield materials 10 are offset and thereby the electronic substrate 1 does not bend. Therefore, a shield performance can be surely maintained without using many tightening components such as bolts and a good electromagnetic performance is exhibited.