SEMICONDUCTOR LASER MODULE

PROBLEM TO BE SOLVED: To enable a ground line corresponding to a modulation signal input line to be shortened in length, by keeping a semiconductor laser from the influence of a temperature and a temperature change outside a package. SOLUTION: A laser mount 104 which holds a semiconductor laser 105 is housed inside a package 101. A first insulating plate 130 and a second insulating plate 131 provided to the side wells of the package 101 are bridged with a bridge plate 110 of ceramics. A microstirp line 111 is formed on the surface of the bridge plate 110, and the one end of the microstrip line 111 is connected to the semiconductor laser 105 with a laser bonding wire 112, and the other end of the microstrip line 111 is connected to the one end of an input lead pattern 113 with an input bonding wire 114. A bridge plate conductive film 122 is formed on the rear of the bridge plate 110, the one edge of the bridge plate conductive film 122 is connected to a ground pad 120 through the intermediary of a contact hole, and the other edge of the conductive film 122 is connected to a grounding lead pattern 123.