FORMATION OF TERMINAL OF THIN-FILM MAGNETIC HEAD

PROBLEM TO BE SOLVED: To provide a method for formation of terminals of a thin-film magnetic head which does not allow residues to remain at magnetic pole layers and leader lines. SOLUTION: The leader lines 3, 4 are formed on the surface of a nonmagnetic layer 2 and a resist layer 11 for preventing...

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Bibliographische Detailangaben
Hauptverfasser: KOKETSU TOSHIYUKI, SUZUKI TOSHIHARU, TAKIGUCHI TAKASHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for formation of terminals of a thin-film magnetic head which does not allow residues to remain at magnetic pole layers and leader lines. SOLUTION: The leader lines 3, 4 are formed on the surface of a nonmagnetic layer 2 and a resist layer 11 for preventing the residues is formed thereon so as to cover their surfaces. At this time, first hole parts 11a are formed on the ends 3a of the leader lines for forming the terminals. Further, the film of a plating base 7 is formed on the resist layer 11 and stop the ends. This plating base is provided thereon with a resist layer 8 for terminal formation having second hole parts 8a. When wet process plating is executed in this state, plating films are grown on the surface of the plating base exposed on the bases of the second hole parts and the terminals 9 are formed. When the resist layer 8 is thereafter removed and the plating base is removed by ion milling, the residues 10 remain in some cases on the flanks of the resist layer 11. The residues are removed together by removing such resist layer 11.