HYDROGEN STORAGE ALLOY UNIT AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To suppress deformation and fine granulation of a substrate by forming a porous metal plating film in a surface of the substrate formed of a hydrogen storage alloy. SOLUTION: Since a porous metal plating film is formed in a substrate surface, this plating film is thick formed,...

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Bibliographische Detailangaben
Hauptverfasser:	MIYANO KIMIE, TOWATA SHINICHI, ITO KAZUHIKO, ITOU TOMOHITO, YOSHIDA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS POWDER METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress deformation and fine granulation of a substrate by forming a porous metal plating film in a surface of the substrate formed of a hydrogen storage alloy. SOLUTION: Since a porous metal plating film is formed in a substrate surface, this plating film is thick formed, deformation and fine granulation of a substrate can be suppressed. This plating film has porosity, so that its weight can be reduced. Through many fine holes provided in the plating film, a hydrogen storage alloy of the substrate can well perform giving/receiving of hydrogen to/from the outside, so that even when this plating film is formed in thickness necessary for suppressing deformation and collapse of the hydrogen storage alloy, decreasing of hydrogen reaction activity due to this thickness can be suppressed. The porous metal plating film has a film part mainly giving mechanical strength to the hydrogen storage alloy and a hole part mainly serving as a route storing/releasing hydrogen. As a material of this plating film, nickel, copper, etc., can be adopted.