CARRIER TAPE AND MANUFACTURE OF CARRIER TAPE

PROBLEM TO BE SOLVED: To provide an inner lead carrier tape with a fine pitch. SOLUTION: When a first trace 11, second traces 12 and pitch-changing traces 14 are formed by etching a metal film 8, the second traces 12 and the pitch-changing traces 14 are made thinner than the first trace 11. The firs...

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Bibliographische Detailangaben
1. Verfasser:	ENDOU KIYOHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an inner lead carrier tape with a fine pitch. SOLUTION: When a first trace 11, second traces 12 and pitch-changing traces 14 are formed by etching a metal film 8, the second traces 12 and the pitch-changing traces 14 are made thinner than the first trace 11. The first trace 11 is formed on a film tape 3, the second traces 12 are formed in a hole 15 formed in the film tape, and the pitch-changing traces 14 are formed on the resin film formed in the hole 15. Thereby, it is possible to connect the second traces 12 with the finer pitch with the first trace 11 with the larger pitch through the pitch-changing traces 14 without causing short circuit. The first trace 11 can be used for connection with a liquid crystal board, and the second traces 12 can be used for connection with a semiconductor device.