FLUX APPLICATION METHOD

PROBLEM TO BE SOLVED: To prevent the contamination of a printed wiring board and a flux- applied device by atomized flux and generation of mulfunction, due to the corrosion of the flux-applied device by the use of water-soluble flux. SOLUTION: The flux application surface of a printed wiring board 1...

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Bibliographische Detailangaben
1. Verfasser:	KAGIYAMA JUNJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent the contamination of a printed wiring board and a flux- applied device by atomized flux and generation of mulfunction, due to the corrosion of the flux-applied device by the use of water-soluble flux. SOLUTION: The flux application surface of a printed wiring board 1 is faced upward, an atomized flux 11, sprayed from the blow-out hole 12a of a spray nozzle 12, is directed downward and spray applied to the soldering surface of the printed wiring board 1. Also, an exhaust device 31 is printed in such a manner that air is exhausted to the down side of the printed wiring board 1, and the non-applied flux 11 is removed by evacuation.