LAMINATION TYPE PACKAGING CONTAINER

PROBLEM TO BE SOLVED: To provide a lamination type packaging container wherein wafers can be freely loaded and taken out by using an automatic machine. SOLUTION: On the inner peripheral face of a fitting part 10 of a container main body 1 with a cylindrical fitting part 10 wherein a lid 2 is freely...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUJIMOTO TOMOJI, ODA MINORU, YOKOTA AKIRA, NOKAWA GEN, ABEKAWA TOSHIJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a lamination type packaging container wherein wafers can be freely loaded and taken out by using an automatic machine. SOLUTION: On the inner peripheral face of a fitting part 10 of a container main body 1 with a cylindrical fitting part 10 wherein a lid 2 is freely removably fitted on the top face of a bottom plate 3, a plurality of sheet springs 11 are projected in such a way that they are projected in the tangential direction of a wafer stored in the container main body 1 and a gap 19 is generated between the apex part and the outer periphery of the wafer 13 and on the lid 2 side, a press lib which presses sheet spring 11 in the wafer 13 direction and brings the apex of each sheet spring 11 into press-contact with the outer peripheral face of the wafer 13 when the lid 2 is fitted in the container main body 1, is provided. In addition, under a condition where the lid body 2 is taken out from the container main body 1, as a gap 19 is formed between the apex of the sheet spring 11 and the outer peripheral face of the wafer 13, it is easily performed to load and take out the wafer 13 in the container main body 1 by means of an automatic machine.