WAFER POLISHING METHOD AND DEVICE

PROBLEM TO BE SOLVED: To prevent spots from being fixed by cooling an abrasive by spray of pure water, restraining the rapid temperature rise of a wafer, and preventing the wafer from being easily dried. SOLUTION: Pure water is sprayed from spray nozzles 2, 2' toward the edges of a rotting wafers 7 during the edge polishing work for the wafers 7. In a wafer polishing device provided with a chuck device for holding the wafers 7, and in which a chuck tape 6 for rotating the wafer 7 around the inclined axis, and a polishing drum 4 in which an abrasive cloth is stuck on its outer periphery of a cylindrical drum member are so arranged as to enable polishing work to the outer peripheral end of the wafer 7 able to be freely rotated around the vertical axis and held by the chuck table 6, the spray nozzles 2, 2' for spraying pure water to the edges of the wafers 7 held by the chuck device and in the polishing work are provided in the suitable parts.