DEPOSITION METHOD OF PLATING LAYER

PROBLEM TO BE SOLVED: To increase adhesion irrespective of conditions of an involved filler and without being influenced by the surface state of a polished surface by polishing the surface of a coating layer for plating, striking the polished surface with fine particles to elute the filler from a ro...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAJIMA YOSHIKO, KITAMURA MICHIHIKO, MOCHI KATSUHIRO, YOSHIMURA MASAHIRO, TANE KAZUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To increase adhesion irrespective of conditions of an involved filler and without being influenced by the surface state of a polished surface by polishing the surface of a coating layer for plating, striking the polished surface with fine particles to elute the filler from a roughened surface, and plating the surface after rendered to the elution. SOLUTION: By polishing a coating layer 21 for plating a surface layer where the coating layer 21 for plating is cured is removed and a filler 21B is partly exposed. Thereafter, by striking the polished surface with fine particles the polished surface is uniformly roughened to form a roughened surface. For this, traces of mechanical polishing is reduced, and the filler 21B buried in the vicinity of the surface is exposed anew. Accordingly, in an eluting process of the filler 21B more surface holes 30 can be formed on the surface of the coated layer 21 for plating, and the surface can be made uniform.