LEAD TERMINAL FORMING DEVICE OF ELECTRONIC PART

PROBLEM TO BE SOLVED: To enable an upper forming die to be mounted independent of mounting directivity so as to carry out a die mounting operation easily when the lead terminals of an electronic part of a lead frame are bent by a method wherein relief holes provided to the upper forming die are formed into ellipses whose major axes extend along the lengthwise direction of the lead frame. SOLUTION: A lower die 3 is equipped with forming dies 5 and 6 on its upper surface and pilot pins 7 to 10 fitted in pilot holes provided to the lateral side bands of a lead frame 1. An upper die 11 is equipped with forming punches 13 and 14 and relief holes 15 to 18 corresponding to the pilot pins 7 to 10. Especially, the relief holes 15 to 18 provided to the upper die 11 are formed into ellipses whose major axes extend along the lengthwise direction of the lead frame 1. Therefore, the upper die 11 can be mounted independent of its sense on an up-down head which moves the upper die 11 in a vertical direction, so that the upper die 11 can be mounted independent of mounting directivity and markedly lessened in mounting man-hours, and a forming device of this constitution is improved in workability.