COPPER PLATED LAMINATED BOARD FOR PRINTED CIRCUIT BOARD AND ADHESIVE AGENT USED THEREFOR

PROBLEM TO BE SOLVED: To realize a copper-plated laminated board where an unroughened foil is used by a method wherein adhesive agent formed of various kinds of prescribed resins is used as adhesive ground represented by a specific formula on a copper foil. SOLUTION: An adhesive ground formed of silane coupling agent represented by a formula I (Q denotes a functional group which reacts with resin composition, R is a coupling group which couples Q with an Si atom, and X, Y, and Z denote a hydrolytic group or a hydroxyl group bonded to Si atom) or thiol coupling agent represented by a formula II (T is aromatic ring or the like, n denotes an integer of two or more) is formed on a copper foil. The copper foil is bonded to a laminated base material with adhesive agent formed of acrylic monomer, diallyl phthalate, peroxide curing resin composition of thermoplastic elastmer which contains ethylene butylene copolymer and styrene copolymer in a molecule, and polyvinyl butyral resin composition possessed of a side chain which contains unsaturated groups through the intermediary of the adhesive ground. The adhesive agent is turned into silanol groups through hydrolysis and reacts on the surface of the copper foil, whereby a copper plated laminated board can be obtained.