LEAD FRAME

PROBLEM TO BE SOLVED: To improve the retaining strength of a suspension pin, and restrain the position change of a mounting part, by constituting the sectional form of the suspension pins for linking and retaining a frame part retaining a plurality of leads and the mounting part on which a semiconductor chip is to be mounted, as a non-planar type. SOLUTION: A rectangular mounting part 2 on which a semiconductor chip is to be mounted is formed in the central part of the frame part 1 of a lead frame. A plurality of leads 3 are stretched vertically and horizontally symmetrically toward four sides of the mounting part from the frame part 1. The mounting part 2 is linked with the frame part 2 and retained by suspension pins 4. The suspension pin 4 has structure whose sectional form is bent, and improves the retaining strength. In the case where the semiconductor chip is mounted on the mounting part 2 and sealing is performed, the position of the mounting part 2 is restrained from changing when stress is applied to the mounting part 2 and the suspension pins 4. Thereby, imperfect sealing can be prevented.