FORMATION OF BUMP USING SHADOW MASK

PROBLEM TO BE SOLVED: To readily form differently laminated bumps on the terminals for flip chips and pads for output terminals of a substrate by using an electroplating method by alternately utilizing a shadow mask for pad for flip chip and another shadow mask for pad for output terminal. SOLUTION: After a first shadow mask 47 from which only the area corresponding to a metallic layer 41 is removed is closely adhered to the pattern of a photosensitive film 46, a copper metallic layer 48 is formed on a metallic layer 45 on the metallic layer 41 by using an ordinary electroplating method. After the shadow mask 47 is removed, a second shadow mask 49 from which only the area corresponding to a metallic layer 42 is removed is closely adhered on the pattern of the photosensitive film 46 and a gold (Au) metallic layer 50 is formed on the metallic layer 45 on the metallic layer 42 by using an ordinary electroplating method. Therefore, differently laminated bumps can be readily formed.