CARBON THROUGH-HOLE PRINTED BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To obtain a carbon through-hole printed board easily at low cost, without polluting the environment by using a C film of specified thickness for connecting circuits on both sides of a printed substrate. SOLUTION: A printed board 1 has printed interconnection circuits connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIBA KAZUHIRO, OOZEKI KATSUTOMO, ENDO MAKOTO, HOSOGAYA TAKESHI, OKAHARA MASAHIRO, CHIYODA HIROYOSHI, SUKEGAWA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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