CARBON THROUGH-HOLE PRINTED BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To obtain a carbon through-hole printed board easily at low cost, without polluting the environment by using a C film of specified thickness for connecting circuits on both sides of a printed substrate. SOLUTION: A printed board 1 has printed interconnection circuits connected through through-holes 3 on sides of an insulation substrate. Using a screen mask of 20-40 microns thick which has a pattern formed by an emulsion, C paste is screen-printed on one or both sides of the substrate 1 and heat set to connect the printed interconnection circuits on both sides by a C film 4 through through-holes 3. The film 4 on the substrate 1 is 10-50 microns thick. Since neither valuable Ag paste is used nor Cu plating requiring a plating bath control and waste water treatment is made, a carbon through-hole printed board 1 can be obtained easily at low cost, without polluting the environment.