CARBON THROUGH-HOLE PRINTED BOARD AND MANUFACTURE THEREOF

CARBON THROUGH-HOLE PRINTED BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To obtain a carbon through-hole printed board easily at low cost, without polluting the environment by using a C film of specified thickness for connecting circuits on both sides of a printed substrate. SOLUTION: A printed board 1 has printed interconnection circuits connected...

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Hauptverfasser: CHIBA KAZUHIRO, OOZEKI KATSUTOMO, ENDO MAKOTO, HOSOGAYA TAKESHI, OKAHARA MASAHIRO, CHIYODA HIROYOSHI, SUKEGAWA TADASHI
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator CHIBA KAZUHIRO
OOZEKI KATSUTOMO
ENDO MAKOTO
HOSOGAYA TAKESHI
OKAHARA MASAHIRO
CHIYODA HIROYOSHI
SUKEGAWA TADASHI
description PROBLEM TO BE SOLVED: To obtain a carbon through-hole printed board easily at low cost, without polluting the environment by using a C film of specified thickness for connecting circuits on both sides of a printed substrate. SOLUTION: A printed board 1 has printed interconnection circuits connected through through-holes 3 on sides of an insulation substrate. Using a screen mask of 20-40 microns thick which has a pattern formed by an emulsion, C paste is screen-printed on one or both sides of the substrate 1 and heat set to connect the printed interconnection circuits on both sides by a C film 4 through through-holes 3. The film 4 on the substrate 1 is 10-50 microns thick. Since neither valuable Ag paste is used nor Cu plating requiring a plating bath control and waste water treatment is made, a carbon through-hole printed board 1 can be obtained easily at low cost, without polluting the environment.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CARBON THROUGH-HOLE PRINTED BOARD AND MANUFACTURE THEREOF
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