METHOD FOR NICKEL PLATING ONTO ALUMINUM ELECTRODE

PROBLEM TO BE SOLVED: To obtain a method for electroless nickel plating onto an aluminum electrode required for formation of a highly reliable electrode. SOLUTION: Nucleus is formed of a deposit 14 of palladium on an aluminum electrode 12 using an activation liquid and a reducing agent, i.e., sodium...

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Bibliographische Detailangaben
1. Verfasser:	TAKASE YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a method for electroless nickel plating onto an aluminum electrode required for formation of a highly reliable electrode. SOLUTION: Nucleus is formed of a deposit 14 of palladium on an aluminum electrode 12 using an activation liquid and a reducing agent, i.e., sodium hypophosphite, is dissolved into pure water. While conditioning the pH in the range of 9.0-12.0 using a sodium hydroxide solution, water is added to produce a solution 15 having total volume of 1000mL. The aluminum electrode 12 of semiconductor element is immersed into the solution 15 and then plated using an oxidation-reduction electroless plating liquid of 80-90 deg.C having pH in the range of 5.0-6.8 thus depositing nickel 16 containing phosphorus on all aluminum electrode 12 of semiconductor element.