CUSHIONING MATERIAL MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a cushioning material manufacturing device of which the constitution is simple, and in addition which can manufacture a high- performance cushioning material by a method wherein a bagging process for paper chips is simplified, and at the same time, a sealing by bondi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUJINAMI YUJI, NOUMI YUUZOU, ARAI GENGO, HAMANO KATSUHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cushioning material manufacturing device of which the constitution is simple, and in addition which can manufacture a high- performance cushioning material by a method wherein a bagging process for paper chips is simplified, and at the same time, a sealing by bonding at the opening part is surely performed to reduce the amount of air remaining in a bag. SOLUTION: By applying a vibration to a packaging bag 6, paper chips, etc., are prevented from sticking to the vicinity of the opening 6b at the top of the bag so that the paper chips, etc., may not become an obstacle when the opening is sealed by bonding. At the same time, by pressing the bag from both sides, excessive air in the bag is removed, and after that, the sealing/ bonding of the opening is performed.