CERAMIC WIRING BOARD

PROBLEM TO BE SOLVED: To improve adhesion between a ceramic board or the ceramic of a package and wiring and to make the resistance of wiring small by making the diameters of the metallic particles in the intermediate layer of printed wiring with three layers structure smaller than upper and lower layers. SOLUTION: Wiring is printed on a green sheet 1 by using a metallic paste 2 and dried. Furthermore, wiring is overlapped and wiring is printed by using a second metallic paste 3 of which the diameters of the metallic particles are smaller than those of the first metallic paste 2, and it is dried. Then, wiring is overlapped and wiring is printed by using a third metallic paste 4 of which the diameters of the metallic particles are larger than those of the second metallic paste 3 and wiring is dried. Then, the plural green sheets thus printed are stacked and they are burnt. Thus, adhesion between the ceramic board or the ceramic of the package and wiring is improved and the resistance of wiring can be made small. Consequently, a semiconductor device where void and delamination are prevented in a multilayer ceramic board can be obtained.