CHIP MONITOR AND METHOD OF CONNECTING CHIPS

PROBLEM TO BE SOLVED: To enable the connection between a semiconductor chip and a lead frame in semiconductor integrated circuit devices of a COL structure and a LOC structure by providing a first and a second bonding means that connect a circuit forming surface and a non-circuit forming surface wit...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIMATA TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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