CHIP MONITOR AND METHOD OF CONNECTING CHIPS

PROBLEM TO BE SOLVED: To enable the connection between a semiconductor chip and a lead frame in semiconductor integrated circuit devices of a COL structure and a LOC structure by providing a first and a second bonding means that connect a circuit forming surface and a non-circuit forming surface wit...

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Bibliographische Detailangaben
1. Verfasser:	MIMATA TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable the connection between a semiconductor chip and a lead frame in semiconductor integrated circuit devices of a COL structure and a LOC structure by providing a first and a second bonding means that connect a circuit forming surface and a non-circuit forming surface with lead parts of a lead frame face to face. SOLUTION: A first mounting head 3, that is the first bonding means, heats the lead part 2a of a lead frame 2 and a semiconductor chip 1 held by a mounting stage with them loaded. A second mounting head 4, that is the second bonding means, transfers the semiconductor chip 1 held by the mounting stage onto the lead part 2a of the lead frame 2 and heats the semiconductor chip 1 and the lead part 2a of the lead frame 2 with them loaded. The connection between the semiconductor chip and the lead frame in the semiconductor integrated circuit devices of the LOC structure and the COL structure is performed.