DIE-BONDING MATERIAL AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain a die-bonding material not requiring any preliminary treatment on the mounting of semiconductors on electronic equipment, resistant to heat on the mounting using a solder, and giving semiconductor devices high in moisture resistance after mounted with the solder. SOLU...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI TOSHIO, YUGAWA MASAHIKO, OKAAKE SHIYUUSAKU, TERASAKI TATSU, OKUGAWA YOSHITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a die-bonding material not requiring any preliminary treatment on the mounting of semiconductors on electronic equipment, resistant to heat on the mounting using a solder, and giving semiconductor devices high in moisture resistance after mounted with the solder. SOLUTION: A die-bonding material comprises (A) a silicone-modified polyimide resin containing a siliconediamine of the formula (R is a 1-4C divalent aliphatic group, an aromatic group; R' is a monovalent aliphatic group, an aromatic group; n is 1-20) in an amount of 5-50mol.% based on all amine components, (B) an epoxy compound, and (c) an active hydrogen-having compound capable of reacting with the component B. The cured product of the die-bonding material has a solubility coefficient of