PRODUCTION OF FLEXIBLE PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method for producing a flexible wiring board having high dimensional stability in which the coefficient of thermal expansion of resin is decreased and curling is eliminated. SOLUTION: A conductor is coated directly with polyimide precursor resin solution and therma...

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Bibliographische Detailangaben
Hauptverfasser:	IRIE TOMOYUKI, KOIZUMI TADAO, HIRAISHI KATSUFUMI, WATANABE TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for producing a flexible wiring board having high dimensional stability in which the coefficient of thermal expansion of resin is decreased and curling is eliminated. SOLUTION: A conductor is coated directly with polyimide precursor resin solution and thermal dried until the concentration of resin in a film exceeds 50wt.%. It is then immersed into a medium exhibiting affinity to a solvent composing the polyimide precursor resin solution and eventually taken out therefrom and heated at 120 deg.C or above.